2015 IEEE Electrical Insulation Conference

7 June 2015 – 11 June 2015 all day
Renaissance Seattle Hotel
515 Madison Street
Seattle, WA 98104

About the Electrical Insulation Conference

The inaugural EIC was held in 1958, and the conference was then held initially annually and then biennially. From 1976 the International Symposium on Electrical Insulation was held in the alternate years up to 2012. The IEEE Dielectrics and Electrical Insulation Society (DEIS) decide to merge both conference series and since 2013 the EIC has returned to being an annual event. The 33rd edition of the EIC will take place in Seattle, WA, USA from June 7 to 10, 2015. Presentations (both oral and poster) and short courses will be offered on the practical applications of electrical insulation systems and materials for all types of electrical and electronic equipment.  Exhibits are also planned where manufacturers of various types of insulating materials and test equipment will display their products to the assembled engineering and research experts who typically attend the EIC.

Conference Themes

The conference is organised around themes relating to specific plant and will feature the latest industrial experience and research in areas including:

  • Rotating Machines
  • Transformers
  • Cables
  • Switchgear
  • Capacitors
  • Outdoor Insulation
  • Variable Speed Drives
  • Printed Circuits and Wire Harnesses
  • Aerospace, Transport and Marine Applications
  • Testing
  • New Materials (including Nanodielectrics)

Papers submitted to EIC must not have been published elsewhere and should be practical, non-commercial and objective.  An IEEE copyright transfer form is required for all submitted papers.  Authors must pay their registration fee in full for their papers to be published in the Conference Proceedings. Papers must be presented at the Conference to be considered for placement in IEEE Xplore. Requests for Letters of Invitation from authors may only be made after payment of the registration fee.

Abstract Submission:

Abstracts of up to 500 words are invited on the practical applications of electrical insulating systems and materials. Please send your Abstract together with the title of the paper, the names of the authors, their affiliation, and the contact information of the corresponding author to the technical chairs:

Ramtin Omranipour        e-mail:  ramtin.omranipour@ge.com

William Chen             e-mail:  chenwill@tecowestinghouse.com

Please contact the Lead Technical Chair, Ramtin Omranipour or Co-Technical Chair, William Chen if you have any questions about the technical programme or your abstract submission.

Please use the attached abstract submission form: EIC 2015 Abstract Submission Form-Blank-Rev 2

Conference Timetable

  • Abstract submission deadline                                     17 October 2014 24 October 2014
  • Notification of abstract acceptance                            14 November 2014
  • Manuscript submission for peer review                    13 February 2015
  • Author registration and full payment required       20 February 2015
  • Finalization of reviewed manuscripts                       17 April 2015

Please use the attached abstract submission form: EIC 2015 Abstract Submission Form-Blank-Rev 2

The following is a Word format for abstract submissions: EIC 2015 Abstract Submission Form-Blank-Rev 2

Please visit official site for updates: 2015 IEEE Electrical Insulation Conference